If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
Widely used in liquid packaging, printing substrate, export product packaging, industrial packaging.
广泛应用于液体包装、印刷基材、出口产品包装、工业品包装等。
The final quality of packaging was decided by the substrate material. So, study about the material effected the history of the LTCC.
LTCC基板材料的性能决定最终封装的质量，故基板材料的研究在LTCC的进展中发挥了重要作用。
The final quality of packaging is decided by the substrate material. Therefore, study on the material effects the history of the LTCC.
LTCC基板材料的性能决定封装的质量，材料的研究在LTCC的进展中发挥了重要作用。
The right combination of face substrate and adhesive glue allows labels to be used on the packaging as well as directly on the merchandise it self.
贴纸可贴在产品包装引起轰动，也有直接贴在商品如服装上的尺码贴纸。 选择不同的胶水及不同的设计，贴纸这种商标可还用在不同的情况及拥有多项用途。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
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