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package substrate

  • 封装基板

网络释义

  精密封装载板类

3、 精密封装载板类Packaging Substrate),涵盖打线(Wine Board)及覆晶(Flip Chip)之各种精密载板(又称为Interposer或Module Board),L/S达2mil/2mil孔径仅1-2mil,...

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短语

IC packaging substrate IC封装基板

Alumina packaging substrate 氧化铝封装基板

双语例句权威例句

  • If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.

    如果这个焊接至布线基板焊盘焊料湿柱状表面整个区域侧表面部分区域。

    youdao

  • Widely used in liquid packaging, printing substrate, export product packaging, industrial packaging.

    广泛应用于液体包装印刷基材出口产品包装、工业品包装等。

    youdao

  • The final quality of packaging was decided by the substrate material. So, study about the material effected the history of the LTCC.

    LTCC材料性能决定最终封装质量,故基板材料的研究在LTCC的进展中发挥重要作用。

    youdao

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