If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
Widely used in liquid packaging, printing substrate, export product packaging, industrial packaging.
广泛应用于液体包装、印刷基材、出口产品包装、工业品包装等。
The final quality of packaging was decided by the substrate material. So, study about the material effected the history of the LTCC.
LTCC基板材料的性能决定最终封装的质量，故基板材料的研究在LTCC的进展中发挥了重要作用。
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