A semiconductor package substrate for preventing deformation mainly comprises a flexible dielectric layer, a plurality of pins, at least one reinforced metal pattern and a solder mask layer.
一种改善变形的半导体封装基板，主要包括一可挠性介电层、多数个引脚、至少一补强金属图案以及一防焊层。
The two chips are mounted on a ceramic substrate, and then hermetically sealed in a ceramic surface mount package.
这两款芯片安装在陶瓷基板，然后密封在一个密封的陶瓷表面贴装封装。
The package includes a chip carrier which has a metal substrate.
所述封装包括有金属基片的芯片支座。
A sensor package generally includes a substrate and one or more sensing elements, located on a surface of the substrate.
一个传感器封装件一般包括一个基底和一个或多个位于基底的表面的传感元件。
The package comprises a substrate, an adhesive layer, a chip and a wire, wherein the chip is bonded to the substrate through the adhesive layer and connected to the substrate through the wire.
该封装件包括基板、粘附层、芯片和导线，芯片通过粘附层键合到基板，并通过所述导线连接到基板。
The connecting part (21) comprises an elastic holding portion for holding the package (14) and a connection portion to be connected with the substrate (2).
该连接部件(21)具有：保持上述封装件(14)的具有弹性的保持部；以及与上述基板(2)连接的连接部。
A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided.
本发明提供了一种接合方法、采用该方法安装半导体封装(pkg)的方法以及由此制备的基底接合结构。
A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided.
本发明提供了一种接合方法、采用该方法安装半导体封装(pkg)的方法以及由此制备的基底接合结构。
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