The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.
这一新型的DDI装置相比传统的COF能提高散热量达20%，因此使得DDI能运行更长时间，并且可靠性更好。
It improves the reliability of sheathing bag and solves the problem of rubber automatic package by adopting the automatic lengthening and shortening longue-like plate.
通过采用自动伸缩的活动舌形板，提高了套袋的可靠性，解决了橡胶的自动包装问题。
Plastic capsulation power bipolar transistor exists many reliability problems due to the structure and package style.
由于其自身的结构与封装形式，塑封双极型功率管存在很多可靠性问题。
In acceptance tests, a moisture resistance test is used to evaluate the anticorrosion property of the package and its relevant quality reliability.
验收项目中，有一个耐湿试验分组，用来加速评定外壳的抗腐蚀性能及相应的质量可靠性能。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
This paper described mainly study of package design and technology for high-reliability high - power microwave circuit.
本文叙述了高可靠大功率微波电路的封装设计及工艺研究情况。
Power consumption not only affects chip package type and cost, also causes the increase of chip temperature, which will decide the reliability of chip directly.
功耗不但直接影响芯片的封装形式与成本，而且过高的功耗将导致芯片温度的增加，直接决定着芯片的可靠性。
The reliability of solder interconnections is dependable on the dynamic response of the board-level package.
为板级封装动态响应分析和焊料微互连应力分析提供了基础。
One of the key questions is: What role does the solder alloy play in the LED package-on-board assembly reliability?
一个关键性问题：焊接合金在焊接led于线路板的可靠性中担当者什么角色？
One of the key questions is: What role does the solder alloy play in the LED package-on-board assembly reliability?
一个关键性问题：焊接合金在焊接led于线路板的可靠性中担当者什么角色？
应用推荐