... 套装软体程式馆 package library 套装软体可靠度 package reliability 校正用套装软体 cal-pac calibration package ...
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The package construction, process flow, and package reliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.
这一新型的DDI装置相比传统的COF能提高散热量达20%，因此使得DDI能运行更长时间，并且可靠性更好。
It improves the reliability of sheathing bag and solves the problem of rubber automatic package by adopting the automatic lengthening and shortening longue-like plate.
通过采用自动伸缩的活动舌形板，提高了套袋的可靠性，解决了橡胶的自动包装问题。
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