Multi-point grounding techniques combined with large areas of paving can enhance anti-interference ability. RF chip's bottom ground. is crucial to discharging heat prolonging the life.
尤其是小型封装的射频芯片底部的大面积铺地很重要，既有利于散热和器件的工作可靠性，又能延长器件的寿命。
These results may be used to simulate the multi -point ground motion as reference.
分析结果可供多点地震动模拟时参考。
These results may be used to simulate the multi -point ground motion as reference.
分析结果可供多点地震动模拟时参考。
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