Samsung Electronics, a global leader in semiconductor and telecommunication has developed a 4gb multi-chip package (MCP) targeted at 3g mobile phones market.
三星电子公司，是全球领先的半导体和电信制定了一个4gb的多芯片封装(MCP)针对3g手机市场。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
应用推荐