• In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.

    3d -MCM(芯片组件)封装设计中,大功率和高热流密度导致系统散热成为关键技术之一。

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  • SMU module adopts the clock-gating method was applied to the survivor path storage block, reduce the survivor path storage memory power dissipation effectively.

    幸存路径管理模块采用门控时钟方法有效地降低幸存路径存储部分的功耗

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  • The invention provides an assembly fixture for a heat dissipation module, which is used for assembling the heat dissipation module on a circuit board.

    发明提供一种散热组装具,用于将散热模组组装于电路板上。

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  • The heat-dissipation module can reduce the wind resistance between airflow and the fins, thereby significantly improving the heat dissipation effect.

    发明的散热模块降低气流之间进而大幅提高散热效果。

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  • Good heat dissipation, module design, fast heat emission.

    散热效果好,模块化设计热量散发

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  • By taking energy dissipation, heat sinking and hardware cost into consideration, a driving module using switching voltage amplifier was designed.

    考虑能耗散热硬件成本因素采用开关式电压放大器,设计了压电晶体执行器的驱动模块

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  • By taking energy dissipation, heat sinking and hardware cost into consideration, a driving module using switching voltage amplifier was designed.

    考虑能耗散热硬件成本因素采用开关式电压放大器,设计了压电晶体执行器的驱动模块

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