In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
在3d - MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
The invention provides an assembly fixture for a heat dissipation module, which is used for assembling the heat dissipation module on a circuit board.
本发明提供一种散热模组组装治具，其用于将散热模组组装于电路板上。
The heat-dissipation module can reduce the wind resistance between airflow and the fins, thereby significantly improving the heat dissipation effect.
本发明的散热模块能降低气流与鳍片之间的风阻，进而大幅提高其散热效果。
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