Series E14 incorporates the latest in microelectronic packaging, LED light sources, and matched sensors.
系列E14采用了最新的微电子封装，LED光源，及配套传感器。
The techniques and application of electroless Nickel Plating on Microelectronic packaging was researched.
本文对微电子封装化学镀镍生产工艺及应用进行了研究。
In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
电子封装中的的焊点可靠性问题一直是电子封装中学科的前沿和热点问题。
So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
为此，必须研究采用先进的微电子组装技术取代落后的常规电子组装技术。
The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
LTCC is the important composite of modern microelectronic packaging. The perfect properties make it useful widely in the high-speed and high-frequency system.
LTCC是现代微电子封装中的重要组成部分，因性能优良而广泛应用于高速、高频系统。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
随着微电子封装焊点尺寸的微型化，微连接尺寸效应对焊点的本构方程产生不可忽视的影响。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
Discrete device packaging is one of the basis and the pioneer of microelectronic technology.
分立器件封装也是微电子生产技术的基础和先导。
It is an urgent demand of new generation packaging materials with excellent properties in the microelectronic industry.
微电子行业迫切需要新一代优异性能的封装材料。
It is an urgent demand of new generation packaging materials with excellent properties in the microelectronic industry.
微电子行业迫切需要新一代优异性能的封装材料。
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