The studies showed that the stability of lycopene was increased by micro encapsulation.
研究表明，经微胶囊化后大大提高了番茄红素的稳定性。
The invention provides a micro encapsulation seal for coaxial cable connectors and method of use thereof.
本发明涉及用于同轴电缆连接器的微囊密封及其使用方法。
The different preparations of micro encapsulation are compared from their characteristics of technology, application and capacity. The application in food industry and future are introduced.
从方法的工艺特点、适用概况和独特性能上比较了微胶囊制备的不同方法，简述了微胶囊化在食品工业中的应用概况及发展前景。
Technique of micro encapsulation in a wall system consisting of compounds such as gelatin and sucrose by spray drying, and mass detection method of lycopene micro encapsulation were outlined.
对番茄红素的提取工艺和以明胶与蔗糖作为壁材喷雾干燥制备番茄红素微胶囊的工艺进行了探讨。
Micro gas pressure sensors are widely used in the fields of chemical industry, spaceflight, foodstuff processing, semi-conductor processing, electronic encapsulation and scientific researches.
微气压传感器广泛应用于化工、航天、食品加工、半导体加工、电子封装以及科学研究等领域。
The experiments showed that micro-encapsulation can improve the storage stability of vitamin C, so it is especially useful in foods, which need high temperature processing.
实验表明，微胶囊化提高了维生素C的使用性能，特别适合于添加在需高温加热的食品中。
The micro-encapsulation technology, including the core and the shell materials, different significant synthesize process, various characterization methods are studied in this thesis.
本文采用微胶囊技术，以不同树脂对不同相变材料进行包裹，并对微胶囊相变材料的性能进行了较系统的研究。
Our drugs aren't candy, it's really hard to mask the taste of medicine through micro-encapsulation.
我们的药品不是糖果。很难通过微胶囊技术掩盖药品的味道。
Micro-encapsulation is widely used and it is not only an additive, but also is the source of new ingredients with matchless properties.
微胶囊技术用途广泛，不仅增加产品的附加值，而且是获得具有特性优良新原料的来源。
With the product of enzymolysis as the wall material, an instant all-red bean drink was made by the micro-encapsulation technology.
并以赤豆酶解产物为壁材，通过制备微胶囊技术制得全赤豆速溶饮品。
In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
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