Deep? Sub? Micron optical lithography process is facing more and more serious challenge.
深亚微米光学光刻工艺技术目前面临着越来越严重的挑战。
One of the most important module improvement is the combination of new LOCOS process development with poly gate lithography process.
关键工艺模块之一是新的LOCOS开发与硅栅光刻工艺改善的结合。
The mold manufacturing is the key part in imprint lithography process, which includes electron beam direct writing, stepping molding, and the conversion from small mold to big mold.
采用电子束直写、步进制模、压印翻制的压印模具生产工艺，其模具的制造是目前面临的难点。
Nonlinear distortion caused by diffraction in the lithography process has severely affected the quality of surface profile, which is the main reason for pattern distortion in lithography.
光刻过程中由于光的衍射效应产生的非线性畸变对光刻面形质量具有严重影响，是造成光刻微结构图形失真的主要原因之一。
In high numerical aperture and low technic factor lithography process, degradation of the image quality because of the coma aberration in the projection lens has become a serious problem.
在高数值孔径、低工艺因子的光刻技术中，投影物镜彗差对光刻质量的影响变得越来越突出，因而需要一种快速、高精度的彗差原位测量技术。
Lithography % - The process used to transfer patterns onto wafers.
光刻-从掩膜到圆片转移的过程。
Next, a mixture of two polymers is added to the metal substrate to create patterns, a process known as diblock copolymer lithography (BCP).
接下来，在金属基板上添加一种由两种聚合物组成的混合物来制作样品，这个工艺过程被称为嵌段共聚物光刻(BCP)。
The process of SU-8 photoresist lithography is researched, and the influence of steps like coating and soft-bake on the lithography is studied.
初步研究了SU-8胶的光刻工艺流程，讨论了涂胶、前烘等各个步骤对光刻结果的影响。
We mainly discuss the treatment of surface of ITO glass and process of lithography.
本文着重介绍了ITO玻璃的表面处理和光刻过程。
In the manufacture process of integrated circuit (IC), lithography occupy a very important step, and the quality of photomask used in lithography affects the yield of LSI.
光刻是大规模集成电路生产流程中十分关键的一环，而光刻中使用的掩模的质量对大规模集成电路的成品率有很大的影响。
A process of soft lithography was introduced for fabrication of PDMS (polydimethylsiloxane) micro-mixer on micro-fluidic chip.
介绍了一种用软光刻技术制作微流芯片上PDMS微混合器的工艺。
During the layerout cutting process for thee beam lithography system, some polygons with one or more inner holes may appear.
电子束曝光机版图切割过程中可能出现带内孔的多边形，并且多边形内环与外环之间可能发生重叠。
The invention mainly relates to a new material and process for immersion lithography.
本发明主要涉及浸渍光刻技术的新材料和工艺。
This process named "IH Process(Integrated Harden Polymer Stereo Lithography)"is a technique for real three dimensional(3D)structure with high aspect ration, and suitable for both polymer and metals.
介绍了微机械加工中的一项崭新技术——IH工艺，即集成聚合物固化立体光刻。
A novel process combining the self-assembly technique with electron beam lithography and selective chemical deposition was proposed for patterned film preparation.
本文提出了一种新颖的结合自组装技术和电子束直写曝光以及选择性化学沉积制备图案化薄膜方法。
This article mainly explains the process of LIGA technology, which includes X-ray mask lithography, Micro-electroforming and Micro-copy.
本文主要阐述了LIGA技术的工艺过程，包括X射线深层光刻、微电铸和微复制工艺。
Using MEMS technics to process the silicon vibration element, in the process two side lithography and etching has being used many times.
介绍了旋转载体用硅微机械陀螺敏感元件的结构和利用双面多次光刻、腐蚀等微机械工艺加工得到硅振动单元的工艺过程。
Lithography is the key technology in integrated circuit technology, the idea originated in printing technology in the photo lithographic process.
光刻是集成电路工艺中的关键性技术，其构想源自于印刷技术中的照相制版技术。
Lithography is the key technology in integrated circuit technology, the idea originated in printing technology in the photo lithographic process.
光刻是集成电路工艺中的关键性技术，其构想源自于印刷技术中的照相制版技术。
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