• After plating with heating except with 1% of the internal stress or plating of sedimentary can avoid this lead a characteristics.

    电镀加热法内应力电镀时与1%沉积避免特性。

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  • After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).

    研究了甲基异丁基酮(MIBK)萃取分离电感耦合等离子体原子发射光谱法(ICP AES)测定镀金杂质元素的新方法。

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  • Lead is also a common constituent of plating wastes, although not so frequently encountered as copper, zinc, cadmium and chromiurn .

    尽管不如那样常见,但它却是电镀废水中的普通组分

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  • No practicable substitutes for lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body are available.

    硼酸玻璃体为基础高压二极管的电镀层替代品仍然不切实际。

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  • Through-thickness cracking also can lead to fatigue or stress corrosion cracking of the base metal beneath the plating.

    形成穿透裂纹造成镀层下本体金属疲劳应力腐蚀裂纹。

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  • Especially in, high-end radiator electroplating, in acid, nickel plated copper plating nickel etc, black has a wealth of experience in production practice, plating industry area is the lead.

    尤其中、高端散热器电镀方面,在酸性有着丰富生产实践经验,在电镀行业领域具有领先地位

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  • All to ROHS standard, plating line with general international environmental protection standards, the lead, cadmium, mercury, hexavalent chromium not to exceed bid.

    所有镀种符合ROHS标准符合国际通用环保标准六价超标

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  • All the ROHS standards, in conformity with the plating line with general international environmental standards, lead, cadmium, mercury, hexavalent chromium not to exceed bid.

    所有镀种符合ROHS标准符合国际通用环保标准,六价超标

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  • The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.

    引线框架镀层质量直接影响着电容器可焊性,所以引线框架电镀层质量的测定方法至关重要。

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  • The lead concentration in Pb-Sn alloy plating bath was determined by standard additional atomic ab-sorption spectrometry, and the optimal determination conditions were obtained.

    采用标准加入原子吸收分光光度法测定合金锭液铅的浓度,试验确定最佳的测定条件。

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  • A kind of lead-dioxide electrode was prepared by plating lead dioxide on the surface of kryptol.

    其中二氧化铅电极通过碳棒上电镀

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  • The lead-free nickel free white and bright nickel substitute plating process…bright nickel substitute tin salt 30g 666 lead-free nickel free white and …

    批发采购电镀助剂-供应666无铅光亮厚白铜(电镀助剂)批发…

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  • Gold, silver and nickel plating of IC lead frame and package shell.

    集成电路引线框架封装壳体镀金、镀镍、镀锡工艺。

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  • Gold, silver and nickel plating of IC lead frame and package shell.

    集成电路引线框架封装壳体镀金、镀镍、镀锡工艺。

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