Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.
方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。
Lead and its compounds may be found in products such as batteries, lead - based paints, lead - containing ceramics, lead solder and leaded petrol.
铅及其化合物可使用于电池油漆陶瓷铅锡焊接及汽油的添加剂上。
We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.
本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。
Nitrogen Protection is used in practical industry because of poor wettability of lead-free solder.
由于无铅钎料润湿性较差，在实际生产中普遍采用氮气保护。
In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
The results show that the free-lead solder powder is best in the efficient atomization efficiency, size distribution and degree of sphericity with helium as the atomizing medium.
结果表明：在一定雾化条件下，氦气雾化粉末具有最高的有效雾化率、良好的粒度分布，且球形度最好；
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
X-RAY-ray inspection using a lead-free solder paste of voids issue, found that the size and diameter welded hollow in acceptable range.
使用X-RAY射线检测了无铅锡膏的焊接空洞问题，发现焊接空洞的大小和直径都在可以接受范围内。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
The products of the company are widely applied in war industry, electronic industry, PCBA surface mounting lead-less solder pallet fixture, watercraft industry, air craft industry, etc.
产品广泛运用于PCBA表面贴装无铅过炉治具、电子产品、军工、船舶工业及航空器等领域。
Due to the consideration of environmental protection, the substitution of lead-containing solder with lead-free solder has become an inevitable trend in the 21st century.
进入21世纪，由于环境保护的要求，锡铅焊料将逐步被无铅焊料所取代。
Experimental results show that lead-free solder paste in the poor mobility of steel line, resulting in deposition area, volume and height of the maximum and minimum fluctuation is obvious;
实验表明，无铅锡膏在钢网上的流动性很差，导致沉积面积，体积和高度的最大值和最小值的波动变化十分明显；
The coating has excellent solder properties and can be used on the surfaces of printed circuit board and patch-like electronic apparatus in order to carry out lead-free electronic packing.
该镀层的可焊性优良，可作为印刷电路板和元器件的表面镀层，从而实现电子封装的无铅化。
The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
The Safe Drinking water Act Amendment of 1986 prohibits the use in potable water systems of any solder having a lead content in excess of 0.2%.
G 1986年颁布的《美国安全饮用水法》规定，任何用于饮用水系统的焊料其铅含量不得超过0.2%。
The use of both lead and lead free solder is acceptable depending on the requirements set forth in the product specific documentation available in Agile.
铅和无铅焊料的使用取决于敏捷的产品的具体文件提出的要求是可以接受的。
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半导体产品使用高含铅的各种设备，模具材料附着焊锡。
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