Lead-free Solder in Electrical Package 电子封装中的无铅化
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.
方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。
Lead and its compounds may be found in products such as batteries, lead - based paints, lead - containing ceramics, lead solder and leaded petrol.
铅及其化合物可使用于电池油漆陶瓷铅锡焊接及汽油的添加剂上。
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