The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
IC package is the smallest unit in electronic systems, compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly.
电子封装作为电子系统的最小组成部分，其简化模型的优劣直接影响电子系统热分析的速度和准确性。本文主要讨论单芯片封装稳态简化热模型的建立。
In addition, the lead and the IC package add inductance as well. Multiple capacitors with low ESL (Equivalent Series inductance) should be used to improve the decoupling effect.
随着频率增加，理想电容的电抗会接近零。然而，这是不可能的，市场上没有这样理想的电容。此外，铅和IC封装也会增加电感。应该用多个低esl 。
The device consists of a single-shot molded plastic package that includes a samarium cobalt pellet, a pole piece , and a Hall effect IC that has been optimized to the magnetic circuit.
该装置由一个单杆模压塑料封装，包括一个钐钴颗粒，一极片和霍尔效应集成电路已优化的磁路。
Samsung Electronics announced that it has developed the industry's first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs.
三星电子最近宣布，他们发明出了工业界第一个TECOF装置，这能用于大屏幕、高分辨率的LCD电视中的显示器驱动器集成电路（DDI）。
This kind of bag applies to package electronic products with moisture-proof requirement: such as PC boards, IC integrated circuit, CD driver, hard disk and electron component parts... etc.
适用于有防潮要求的电子产品包装：各类PC板、IC集成电路、光驱、硬盘、电子元器件等。
The over-molded package, holds together a samarium cobalt pellet, a pole piece and a true zero-speed Hall IC that has been optimized to the magnetic circuit.
在超模压封装，拥有一个共同钐钴颗粒，极片和一个真正的零速霍尔IC进行了优化的磁路。
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC)."
该器件提供两种封装：8引脚、0.3英寸宽、小型塑料或密封双列直插式封装（小型DIP）；以及8引脚小形集成封装（SOIC）。
The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit.
为了让IC芯片发挥机能，就必需连接构装或直接连接印刷电路。
To improve the precision and efficiency of the integrated circuit (IC) package, a 2-dof high speed and high precision XY positioning table driven by voice coil actuator is presented.
针对一类音圈电机直接驱动的二自由度高速精密定位平台，为了在高速高加速情况下，获得良好的动态特性，对其动力学控制方法进行研究。
Pin grid array (PGA) ApplicationThis package is equipped with advanced IC chips, such as ASIC, used mainly for the mpu of a computer and communications equipment.
引脚网格阵列(PGA)用途主要供给高阶ic使用如在ASIC等高功能芯片，主要使用于计算机的MPU或通信设备等里面。
Pin grid array (PGA) ApplicationThis package is equipped with advanced IC chips, such as ASIC, used mainly for the mpu of a computer and communications equipment.
引脚网格阵列(PGA)用途主要供给高阶ic使用如在ASIC等高功能芯片，主要使用于计算机的MPU或通信设备等里面。
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