The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for IC package were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
IC package is the smallest unit in electronic systems, compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly.
电子封装作为电子系统的最小组成部分，其简化模型的优劣直接影响电子系统热分析的速度和准确性。本文主要讨论单芯片封装稳态简化热模型的建立。
To improve the precision and efficiency of the integrated circuit (IC) package, a 2-dof high speed and high precision XY positioning table driven by voice coil actuator is presented.
针对一类音圈电机直接驱动的二自由度高速精密定位平台，为了在高速高加速情况下，获得良好的动态特性，对其动力学控制方法进行研究。
To improve the precision and efficiency of the integrated circuit (IC) package, a 2-dof high speed and high precision XY positioning table driven by voice coil actuator is presented.
针对一类音圈电机直接驱动的二自由度高速精密定位平台，为了在高速高加速情况下，获得良好的动态特性，对其动力学控制方法进行研究。
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