This effect is very significant at low substrate temperature or high deposition rate.
而且能量的影响在较低的基片温度或是较高的沉积速率时更加显著。
High ionization rate, full reaction, pure film color, fast deposition.
离化率高，膜层反应充分，使膜层颜色纯正，沉积速度快。
Thus, using this CVD configuration a relatively high deposition rate can be achieved while obtaining desired levels of coating uniformity.
因此，使用所述CVD配置可达到相对较高的沉积速率，同时获得所要程度的涂层均一性。
MPE technique shows remarkable advantages such as single precursor, wide choices of source materials, high deposition rate, and no subsequent annealing.
MPE制备薄膜技术采用单一先体溶液，源物质来源广泛，沉积速率快，不需后续热处理。
Direct current hot cathode plasma glow discharge chemical vapor deposition (DC-HCPCVD) is a new method to deposit high quality diamond films with high growth rate.
直流热阴极辉光放电等离子体化学气相沉积法是我们建立的快速沉积高品质金刚石膜的新方法。
Hot cathode chemical vapor deposition method was established in order to deposit high-quality diamond films with high deposition rate.
为快速沉积高品质金刚石膜，建立了热阴极等离子体化学气相沉积方法。
By simulation of thin films growth, some microscopic processes can be revealed in extreme condition, such as high temperature and high deposition rate.
在该模型中，我们考虑了沉积速率、沉积温度以及沉积角度等影响薄膜生长的参数。
To realize high deposition rate is an important problem in low-cost industrialization of microcrystalline silicon solar cells.
实现高速沉积对于薄膜微晶硅太阳电池产业化降低成本是一个重要手段。
An electroless nickel plating process with high deposition rate was optimized by orthogonal test.
通过正交试验法优选出一种具有高磷含量的快速化学镀镍工艺配方。
An apparatus is presented in this paper, designed for the synthesis of diamond films at a rather high deposition rate.
设计了一种以较高速度合成金刚石薄膜的装置。
The result shows that this method has a high surface alloying and deposition rate, and the multiple structure made of alloying and coating layers can be formed, in double glow suface alloying process.
将多重空心阴极溅射靶应用于双辉离子金属渗镀试验。结果表明，这种方法可以加速金属渗镀层的形成。
In particular, the amorphous titanium oxide is obtained by using the reactive sputtering method and via deposition at a low temperature and at a high film formation rate.
特别是利用反应性溅射法，在低温下以高成膜速度进行堆积，得到非晶的氧化钛。
Electrodeposition plating has fast the advantages of high deposition rate, smooth surface, and low costs.
电镀具有镀速快、表面平整、生产成本低等优点。
Electrodeposition plating has fast the advantages of high deposition rate, smooth surface, and low costs.
电镀具有镀速快、表面平整、生产成本低等优点。
应用推荐