• When current flows through a conductor, a magnetic field is formed around the conductor.

    通有电流导体周围产生磁场。

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  • A via hole is formed in the substrate within the spirally patterned conductor layer, the via hole being formed by through silicon via (TSV).

    形成于螺旋图案化导体内部基材中,介层洞通过通孔技术制成

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  • C is a second coil formed by a conductor of much larger size and smaller length, wound around and in proximity to coil a.

    线圈相当尺寸较小长度构成环绕线圈a接近

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  • Some internal antennas are formed by a plated conductor on a substantially flat circuit board.

    某些内部天线通过充分平坦电路板镀敷导体形成

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  • Well area extending conductor layers are filled into the opening, and then a virtual bit line which is electrically connected with the well area extending conductor layers is formed on the substrate.

    开口填满井区延伸导体接着再在基底形成连接井区延伸导体层虚拟线

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  • The cable is formed by extruding the foam composition onto a signal carrying conductor and sheathing the foam-coated signal carrying conductor in an appropriate conducting shield.

    泡沫组合物挤出信号携带导体上,将包泡沫体信号携带导体包封合适的导电防护套内,从而形成了电缆

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  • The coil (12) has a cutoff part (13) formed by cutting off at least a part of the conductor.

    线圈(12)具有至少一部分导线切断切断(13)。

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  • In the conductor layer formation step, a single conductor layer including first and second measurement points is formed on a substrate.

    上述导电体膜形成工序中,在基板上形成包含第一测定第二测定部的单一的导电体膜。

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  • A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent.

    绝缘部分导电体层形成溶液形成钯导电体层,述溶液含有化合物化合物还原剂

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  • On the palladium conductor layer is then directly formed a copper deposit by electroplating.

    然后通过电镀在导电体层直接形成沉积物

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  • If the conductor layer has a disconnected portion in the first measurement step, a repairing conductor is formed on the disconnected portion.

    上述第一测定工序中判明了在上述导电体膜上存在断线部位时,断线部位上形成修补用的导电体。

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  • If the conductor layer has a disconnected portion in the first measurement step, a repairing conductor is formed on the disconnected portion.

    上述第一测定工序中判明了在上述导电体膜上存在断线部位时,断线部位上形成修补用的导电体。

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