Remove excess solder with small brush while plastic leaving a fillet around end of valve as it cools.
当焊料处于粘滞状态时，用刷子把多余的焊料清除干净。焊料冷却后，将一条嵌条环绕在阀门的端口。
The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate.
该牺牲电路基板的焊盘和孔与该电路基板的多余焊料垂直接近地放置(64)。
A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable.
一种用于从电路基板垂直去除多余焊料的方法，该方法包括利用具有可吸附焊料的多个焊盘和孔的牺牲电路基板(60)。
The Safe Drinking water Act Amendment of 1986 prohibits the use in potable water systems of any solder having a lead content in excess of 0.2%.
G 1986年颁布的《美国安全饮用水法》规定，任何用于饮用水系统的焊料其铅含量不得超过0.2%。
The Safe Drinking water Act Amendment of 1986 prohibits the use in potable water systems of any solder having a lead content in excess of 0.2%.
G 1986年颁布的《美国安全饮用水法》规定，任何用于饮用水系统的焊料其铅含量不得超过0.2%。
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