This paper introduced a soft built-in self-repair mechanism for embedded SRAM, and analyzed repair efficiency and area overhead of this mechanism.
本文介绍一种分段列冗余的软修复机制，并分析该修复机制的性能、面积开销。
With the continuously improving of the microelectronics craft technique level, embedded SRAM present a trend of the higher integration, higher speeding and lower power.
随着微电子工艺技术水平的不断提高，嵌入式SRAM呈现出更高集成度、更快速及更低功耗的发展趋势。
With the continuously improving of the microelectronics craft technique level, embedded SRAM present a trend of the higher integration, higher speeding and lower power.
随着微电子工艺技术水平的不断提高，嵌入式SRAM呈现出更高集成度、更快速及更低功耗的发展趋势。
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