• For analyzing the thickness of the electroplating layer, the product qualities would be increased.

    分析影响板面镀层厚度均匀的因素,达到提高产品质量。

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  • Recommended substrate: harden PC, harden PMMA, the surface of UV coating, electroplating layer, stainless steel, stone, marble, glass, etc.

    适用基材:加硬pc,加硬pmma,UV漆面,电镀面,不锈钢,石头,大理石,玻璃等。

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  • Because the composite electroplating layer containing diamond grains must be distributed on the hole surface of die, it brings some difficulties to the process.

    由于含有金刚石颗粒的复合镀层要镀在胎具的内孔孔壁上,所以给电镀工艺带来一定的困难。

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  • Electroplating: use the principle of electrolysis, the metal and alloy parts deposition in the surface, form even, density, good adhesion of the metal layer process.

    电镀:利用电解原理,使金属或合金沉积在制件表面,形成均匀、致密、结合力良好的金属层的过程。

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  • Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.

    金属铜与塑料的膨胀系数比较接近,因此,在塑料电镀中常用化学镀铜层作为电镀的导电镀层。

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  • As the electroplating pure copper layer on copper alloy exceeds a critical thickness, the surface electroplating treatment can improve the copper alloy's resistance against oxidation failure greatly.

    当铜合金表面的电镀纯铜层厚度超过一个临界值,表面电镀纯铜处理可以明显改善材料的耐氧化剥离性。

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  • Electroplating is to use the principle of electrolysis in some metal surface plating a thin layer of the other metal and alloy process.

    电镀就是利用电解原理在某些金属表面上镀上一薄层其它金属或合金的过程。

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  • The method further includes electroplating copper gapfill onto the seed layer.

    该方法进一步包括在该种晶层上电镀铜空隙填充。

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  • On the palladium conductor layer is then directly formed a copper deposit by electroplating.

    然后通过电镀在钯导电体层上直接形成铜沉积物。

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  • Through the electroplating, can be in mechanical products won adornment of protective and various functional surface layer, still can repair wear and processing error of workpiece.

    通过电镀,可以在机械制品上获得装饰保护性和各种功能性的表面层,还可以修复磨损和加工失误的工件。

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  • Finally, annealing process is carried out in the electroplated metal layer formed by the electroplating process through chemical vapor deposition method under promotion of ammonia plasma.

    之后,利用氨气等离子体促进化学气相沉积法对上述经电镀制程而形成的电镀金属层进行退火处理。

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  • The first layer encases the eternal surfaces of the metallic core and is produced by electroplating copper or copper alloy from a first bath containing copper ions.

    第一层包覆所述金属芯的外表面,并且通过从包含铜离子的第一浴中电镀铜或铜合金产生。

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  • Suitable com- pound Ni electroplating or electroless Ni plating solution were chosen to make low stress Ni layer.

    采用合适的电解镍液或化学镀镍液的配方来制取低应力镍层;

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  • After the acid zinc dipping, the plating layer obtained by either electroplating or chemical plating has excellent performance.

    经过酸性浸锌后无论进行电镀还是化学镀,得到的镀层性能优异。

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  • Adopting pulse electroplating can obtain more excellent performance of the plating layer than the traditional DC electroplating.

    采用电子脉冲电镀可以获患上比采用直流电镀更优良的镀层性能。

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  • Adopting pulse electroplating can obtain more excellent performance of the plating layer than the traditional DC electroplating.

    采用电子脉冲电镀可以获患上比采用直流电镀更优良的镀层性能。

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