Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
Is there an active continuous improvement team for plating voids in the electroless copper operation?
化学沉铜是否对电镀空洞有积极的持续改善小组？
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
Metals suitable for electroless metal plating on fabrics are copper and nickel.
适于织物化学镀的金属是铜和锋，孰优？
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.
研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
The reaction process of electroless copper plating can be controlled by adjusting the OH-additional amounts, thus to control the morphology of Cu coatings.
通过控制镀液中OH-的补加量，能够准确控制化学镀铜反应进程及表面镀层包覆程度；
The research keystones of copper electroless plating were presented.
提出了化学镀铜今后的研究重点。
Electroless nickel copper phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in electroless nickel phosphorus alloy plating bath.
在化学镀镍-磷合金液中加入硫酸铜制得镍-铜-磷三元合金。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
Semi-automatic rolling copper, nickel, silver, zinc, tin, etc. and electroless nickel plating.
半自动滚镀铜、镍、银、锌、锡及无电解镀镍等。
Interfacial strength would be increased between carbon nanotubes and metal-matrix through electroless plating a continuous layer of copper on carbon nanotubes.
通过化学镀在碳纳米管表面镀上一层连续的铜镀层，以改善碳纳米管与金属基体的润湿性，增强界面结合力。
Conductive Poly (ethylene terephthalate) (PET) fabrics were prepared by electroless copper and nickel plating.
采用化学镀的方法制备镀铜和镍导电涤纶织物。
The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good…
结果表明，采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀， 光泽性好， 镀层结合力强，导电性能显著提高。
The disadvantages of common electroless copper plating process were pointed out.
指出了普通镀铜工艺的缺点。
The replacement deposition method is applied to electroless copper-plating on the magnetic fly-ash powder.
笔者采用置换反应法在粉煤灰空心磁粉表面进行了化学镀铜的研究。
Electroless copper plating was Used for graphite powder to solve the interface problem in metal7 graphite composite material manufacture and improve its comprehensive properties.
在石墨粉表面化学镀铜，以解决金属-石墨复合材料制造中的界面结合力问题并提高其综合性能。
Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline.
因此，用钯导电体层形成溶液将工件转变成导体，所述溶液是中性的，不使用高碱性无电镀铜溶液。
The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer.
提供了保护过程的技术细节，首先在光纤表面进行化学镀处理获得导电的薄镍层或铜层，然后在该导电层上进行电镀镍。
The electroless copper plating system with sodium hypophosphite as the reducing agent has been received people's attention.
由于金属铜对次磷酸钠的氧化没有催化作用，需要加入镍离子作为催化剂。
The coatings of nickel-phosphor and nickel-copper-phosphor are prepared on the pretreated metal surface by electroless plating technology. The coating surface has been characterized by XPS and SEM.
采用化学镀技术在预处理后的金属表面上制备镍磷二元和镍铜磷三元镀片，用X射线光电子能谱分析仪和扫描电镜分别对镀片表面的元素价态、组成及镀片表面的形貌进行表征。
The coatings of nickel-phosphor and nickel-copper-phosphor are prepared on the pretreated metal surface by electroless plating technology. The coating surface has been characterized by XPS and SEM.
采用化学镀技术在预处理后的金属表面上制备镍磷二元和镍铜磷三元镀片，用X射线光电子能谱分析仪和扫描电镜分别对镀片表面的元素价态、组成及镀片表面的形貌进行表征。
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