化学镀铜(Electroless plating copper),俗称沉铜,是现今工业中应用最为变普通、广泛的镀种。化学镀铜是一种自身的催化氧化还原反应，首先用活化剂处理，使绝缘基材表面...
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Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
Is there an active continuous improvement team for plating voids in the electroless copper operation?
化学沉铜是否对电镀空洞有积极的持续改善小组？
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
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