The section morphology and peeling intensity of electroless nickel deposit were analyzed by means of SEM and EDS.
采用SEM、EDS等实验手段分析了化学镀镍层的断面形貌和剥离强度。
A new electroless silver plating process for diamond was pressented with improvements on deposit adhesion and anti-tarnishing of silver deposit.
经粗化处理，可以提高镀层结合力，而又不影响镀层光泽。
The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good…
结果表明，采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀， 光泽性好， 镀层结合力强，导电性能显著提高。
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
化学镀铜层的显微结构受基体的显著影响。
Electroless nickel-phosphorus alloy deposit has many peculiar physical and chemical properties, yet its application is limited for high cost.
化学镀镍磷合金具有很多独特的理化性能，然而由于成本较高限制了其应用。
Electroless nickel-phosphorus alloy deposit has many peculiar physical and chemical properties, yet its application is limited for high cost.
化学镀镍磷合金具有很多独特的理化性能，然而由于成本较高限制了其应用。
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