The section morphology and peeling intensity of electroless nickel deposit were analyzed by means of SEM and EDS.
采用SEM、EDS等实验手段分析了化学镀镍层的断面形貌和剥离强度。
A new electroless silver plating process for diamond was pressented with improvements on deposit adhesion and anti-tarnishing of silver deposit.
经粗化处理，可以提高镀层结合力，而又不影响镀层光泽。
The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good…
结果表明，采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀， 光泽性好， 镀层结合力强，导电性能显著提高。
应用推荐