The temperature for tungsten coating on copper substrate is higher than that on molybdenum.
当其它条件都相同时，在铜基体上获得钨镀层比钼基体上所需的温度略高一些；
Results showed that adhesion between film and copper substrate could be greatly improved using such interlayers.
采用钛铝-钼过渡层，金刚石膜和铜衬底间的结合力大大提高。
At the same time the size of the copper substrate and the cooling condition of substrate's bottom are optimized.
并对铜基板尺寸、基板底面散热条件等几项关键参数进行了优化设计。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 ：该工艺镀液稳定 ，可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
The microstructure of surface Fe-based infiltrated layer on copper substrate and the bending behavior are investigated.
研究铜合金表面铁基渗层的微观组织以及铜基表面渗层的弯曲行为。
It was shown that the particle shape deposited on the copper substrate was very sensitive to the strain extent of substrate.
实验表明沉积在铜表面的铝颗粒形状与局域应力缓释有直接的联系。
The features and microstructure of the cladding layer and interface layer between cladding layer and copper substrate were analyzed.
对熔覆层和熔覆层与基体结合区的形貌和微观组织进行了研究。
This paper introduced a new copper treatment agent ST-10+ for improving the adhesion of dry film to printed circuit board copper substrate.
本文介绍了一种能提高干膜与线路板铜基粘合力的新型铜面处理剂ST-10+。
The results show that the cladding layer has compact and flawless microstructure and has been metallurgically integrated with pure copper substrate.
结果表明：所制得熔覆层组织致密、无裂纹，与基体形成了良好的冶金结合。
Based on developed numerical simulation method, the impacting behavior of copper particle colliding copper substrate in process of transforming material property is investigated.
采用有限元数值计算方法，研究冷喷涂材料改性过程中铜粒子与铜基体非垂直碰撞的变形行为。
They replace half the iron with copper, and make crystalline nanoparticles of the resulting compound, which they coat on a cloth-like carbon substrate.
研究小组用铜代替了二分之一的铁，并用纳米晶体来制作所需要的化合物，在碳棒的底部穿上了化合物这件衣服。
A number of scientists, yet, are focussing on the improvement of graphene growth over transition metal substrate such as copper foil substrate.
但一些科学家仍致力于改进借助过渡金属基质的石墨烯生产方法，比如说借助铜箔基板。
Compared with other conductive metal layer, copper coating with small with stress, high mechanical strength, the plastics substrate and coating binding force is good wait for a characteristic.
与其它导电金属层相比，镀铜层具有应力小、机械强度高、塑料基体与镀层结合力好等特点。
Cobalt salt was employed as catalyst precursors, copper plate as substrate and ethanol as carbon source.
采用乙醇催化燃烧法，以钴盐作为催化剂先体、薄铜片作为基底制备碳纳米管。
These indicate that copper is an ideal substrate for the preparation of thick diamond films.
因此铜是制备金刚石厚膜的理想基体材料。
Thus, the reliability of connection between the copper part present on a substrate and the copper deposit formed by electroplating is significantly high.
因此，基板上存在的铜部分和通过电镀形成的铜沉积物之间的连接的可靠性是显著的。
A positron annihilation technique has been employed to study the microdefects of copper alloy sprayed on a steel substrate by plasma after being compressed in different thickness.
本文用正电子湮没技术对等离子体喷涂铜基合金压缩形变的微观缺陷进行了测量。
The paper provides several substrate plating technologies of zinc alloy cast piecework to substitute cyanide copper plating.
本文介绍了几种取代氰化镀铜的锌合金电镀打底工艺。
The potential-time curves under constant current and cyclic voltammetry curves were measured, and the potential activation process of copper plating on iron substrate in cyanide electrolyte was shown.
进行了恒电流电位-时间曲线和循环伏安曲线的测定，显示了铁电极进行氰化物镀铜时，镀层沉积前铁表面的电位活化过程。
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
化学镀铜层的显微结构受基体的显著影响。
The results show that Ar-H2 plasma treatment of the Au substrate leads to a significant enhancement of the uniformity of the copper deposition layer.
结果显示利用氩氢等离子体对金基底材料表面进行处理能有效地提高铜沉积层的均一性。
The relative increment of microhardness with the substrate of red copper is the biggest.
在紫铜基体上，显微硬度的相对增量最大。
The photoelectric parameter of copper and aluminum plate substrate high-power white LED bulbs and its discipline of the temperature change were studied in the same test conditions.
在相同测试环境条件下，对铜基板和铝基板封装的大功率白光LED灯泡的光电参数，以及其点亮后温度的变化规律进行了研究。
The invention can reduce signal loss of copper foil cladding substrate, improve signal transmission speed and reduce production cost.
本发明可降低覆铜箔基板的信号损失，提高 信号传播速度以及降低生产成本。
The invention can reduce signal loss of copper foil cladding substrate, improve signal transmission speed and reduce production cost.
本发明可降低覆铜箔基板的信号损失，提高 信号传播速度以及降低生产成本。
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