A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
The absorption curves of the brightener UBAC 1a of bright acid copper plating and cupric sulfate of the bath were mensurated by experiments respectively.
通过实验分别测定了酸性镀铜光亮剂ubac1a和镀液中硫酸铜的吸收曲线。
Main products are as follows: a circuit board, gilded burnish, gold plated copper thick OSP protection (series), PCB plating copper brightener, PCB tin brightener, etc.
主要产品如下：一、线路镀金光泽剂、线路板镀厚金工艺、线路板铜保护(osp)系列、线路板镀酸铜光亮剂、线路板镀锡光亮剂等。
Main products are as follows: a circuit board, gilded burnish, gold plated copper thick OSP protection (series), PCB plating copper brightener, PCB tin brightener, etc.
主要产品如下：一、线路镀金光泽剂、线路板镀厚金工艺、线路板铜保护(osp)系列、线路板镀酸铜光亮剂、线路板镀锡光亮剂等。
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