A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.

采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。

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The absorption curves of the brightener UBAC 1a of bright acid copper plating and cupric sulfate of the bath were mensurated by experiments respectively.

通过实验分别测定了酸性镀铜光亮剂ubac 1a和镀液中硫酸铜的吸收曲线。

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Main products are as follows: a circuit board, gilded burnish, gold plated copper thick OSP protection (series), PCB plating copper brightener, PCB tin brightener, etc.

主要产品如下：一、线路镀金光泽剂、线路板镀厚金工艺、线路板铜保护(osp)系列、线路板镀酸铜光亮剂、线路板镀锡光亮剂等。

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