The troubles occurred in CMP technology are analyzed and some suggestions are proposed.
分析了目前CMP技术存在的问题，提出了可能解决问题的一些建议。
However, the traditional CMP technology has some disadvantages and limitations. It is important to research and develop new planarization technology while improving the traditional CMP technology.
然而，传统CMP技术还存在一定的缺点或局限性，人们在不断完善CMP技术的同时，也在不断探索和研究新的平坦化技术。
At the present time, chemical mechanical planarization (CMP) is the most effective technology for global and local planarization of the wafer in IC manufacturing.
目前，化学机械抛光技术(CMP)被认为是能够实现晶圆表面局部平坦化和全局平坦化的最佳方法。
The method throws away the idea of traditional common mid-poit (CMP) stack and solves at root the difficulty met by traditional seismic processing technology based on CMP method.
该技术抛开了传统共中心点叠加的思想，从根本上解决了以CMP方法为基础的传统地震处理技术遇到的困难。
Due to technology push and application pull, the Chip Multiprocessors (CMP) have become the trend of the high performance microprocessors.
在工艺和应用的双重推动下，片上多核处理器成为当前高性能微处理器的发展趋势。
The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.
对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。
The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.
对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。
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