The troubles occurred in CMP technology are analyzed and some suggestions are proposed.
分析了目前CMP技术存在的问题，提出了可能解决问题的一些建议。
However, the traditional CMP technology has some disadvantages and limitations. It is important to research and develop new planarization technology while improving the traditional CMP technology.
然而，传统CMP技术还存在一定的缺点或局限性，人们在不断完善CMP技术的同时，也在不断探索和研究新的平坦化技术。
At the present time, chemical mechanical planarization (CMP) is the most effective technology for global and local planarization of the wafer in IC manufacturing.
目前，化学机械抛光技术(CMP)被认为是能够实现晶圆表面局部平坦化和全局平坦化的最佳方法。
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