• Thesensor is fabricated by the conventional CMOS process.

    该传感器由通用的CMOS工艺制成。

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  • An ESD protection circuit for IC CARDS is described, which is based on CMOS process.

    介绍了ESD保护结构的基本原理,并提出一个基于CMOS工艺用于IC卡芯片的保护电路。

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  • MEMS devices with minimum volume and cost were realized by the embedded CMOS process.

    通过这种嵌入式CMOS工艺技术,可以实现具备最小体积、最低成本的MEMS器件。

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  • This circuit structure is simple and can be realized by the standard CMOS process easily.

    该电路结构简单,易于实现,且制作工艺与标准CMOS工艺完全兼容。

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  • The inductor and capacitor in CMOS process is an important issue in designing LNA and VCO.

    CMOS工艺的电容和电感是设计lna、VCO等射频电路需要考虑的重要问题。

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  • The high-voltage CMOS process used to fabricate this device also means it can endure voltage surges up to 30V.

    用于制造这种装置的高压CMOS工艺也意味着它可以承受浪涌电压高达30V。

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  • We analyze several CMOS process compatible photodetectors which are promising to be applied to the VSR receiver.

    分析了几种有希望用于VSR系统的CMOS工艺兼容的光电探测器。

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  • The design of the tungsten micro-hotplate can be applied to other thermal-based sensors in the standard CMOS process.

    本文的钨微热板的设计可以应用到相关的与标准CMOS工艺兼容的热传感器的设计之中。

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  • To reduce the cost, the CMOS process was adopted. This paper introduces each module, especially bandgap and watchdog.

    本文分别对系统中各个模块做了介绍,特别介绍了带隙基准电压源和看门狗这两个重点模块。

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  • The responsivity dependent on the insulated medium and passivation layers in CMOS process and reverse bias is also discussed.

    还就反向偏压以及CMOS工艺中介质与钝化层等因素对探测器响应度的影响进行了讨论。

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  • With the downscaling of CMOS process and reduction of voltage supply, it is more difficult to design high-gain OPAMPs than before.

    随着CMOS工艺中单管特征尺寸和电源电压的下降,设计高增益运算放大器很困难。

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  • The simulating results have proved that the designed circuit has good characteristics. The circuit realized with the standard CMOS process has higher practical value.

    仿真结果验证了电路具有良好特性,该电路采用标准CMOS工艺实现,具有较高的实用价值。

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  • The research on the circuit structure and the process technique is carried out to satisfy the demands, especially, the investigation on the ADC manufactured with standard CMOS process.

    为了满足这些需求,需要在电路结构和工艺技术方面进行不断的研究,特别是应用标准CMOS工艺来制造这种ADC。

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  • The resistance transformation type memorizer with a buffer layer structure has simple manufacturing process and low manufacturing cost, and is compatible to the traditional CMOS process.

    本发明提供的具有缓冲层结构的电阻转变型存储器制造工艺简单、制作成本低并且与传统CMOS工艺兼容。

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  • It combines a low cost, high speed CMOS process and a novel architecture to achieve the resolution and speed of existing hybrid implementations at a fraction of the power consumption and cost.

    它采用高速、低成本的CMOS工艺及新颖的架构,分辨率和速度均达到现有混合方案的水平,而功耗与成本却低得多。

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  • The nano electronic part and the production method thereof have the advantages of simplicity, stability, reliability, fewer process procedures and compatibility with the traditional CMOS process.

    这种纳米电子器件及其制造方法具有简单、稳定可靠、工艺步骤少、与传统CMOS工艺兼容的优点。

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  • Circuits of CMOS-process-compatible monolithic photoreceivers are designed. The circuits include photodetector, pre-amplifier and main amplifier.

    设计了与CMOS工艺兼容的光电单片接收机电路,其中包括光电探测器、前置放大器和主放大器。

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  • Circuits of CMOS-process-compatible monolithic photoreceivers are designed. The circuits include photodetector, pre-amplifier and main amplifier.

    设计了与CMOS工艺兼容的光电单片接收机电路,其中包括光电探测器、前置放大器和主放大器。

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