• The integration technologies of RTD with HEMT, HBT and CMOS devices are first introduced.

    首先对RTD与化合物半导体HEMT,HBT以及硅cmos器件的集成工艺进行了介绍。

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  • The high-voltage CMOS devices can be used in high-voltage integrated circuit(HV-IC) such as driver ICs for PDP and FED.

    高压CMOS器件的研制可为进一步研制FED和PDP平板显示高压驱动电路奠定基础。

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  • However, as the design rule continuously shrank down beyond the 45 nm, conventional planar CMOS devices encounter significant challenges.

    不过,当设计规章向45奈米以下持续缩小时,传统的平面的电晶体将遇到很多显著的挑战。

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  • This dynamic body discharge technique eliminates body potential mismatches of PD SOI CMOS devices, achieving repeatable low threshold voltage and fast SRAM access time.

    这种动态体放电的方法有效地解决了部分耗尽SOICMOS器件体电位不匹配的问题,得到了可重复性低阈值电压,提高了SRAM的读取速度。

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  • The multiplexer can be constructed from either mechanical switches or solid-state devices (such ad CMOS switches).

    多路开关可以用机械开关或者固态器件(例如CMOS)开关构成。

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  • DOC circuitry is designed to drive CMOS input devices, which are capacitive in nature, in point-to-point applications (one receiver input per driver output).

    在点对点应用中(每驱动器输出对一个接收器输入),设计DOC电路驱动原本为容性的CMOS输入的器件。

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  • The prepared CMOS image sensor meets the requirement for technological parameters of devices, has high fill factor and effectively improves the image quality of the CMOS image sensor.

    本发明制备得到的CMOS图像传感器满足器件工艺参数并且填充因子高,有效地提高CMOS图像传感器的图像质量。

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  • A systematic approach is used to analyze the noise in CMOS low noise amplifier (LNA), including channel noise and induced gate noise in MOS devices.

    采用系统研究方法来分析包括MOS器件的沟道噪声和感应栅噪声在内的CMOS低噪声放大器中的噪声,并提出了一个新的噪声系数解析式。

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  • So in recent years, much of the research in optical computing has focused on finding CMOS-compatible ways to integrate electronic and photonic devices.

    所以近几年来,许多关于光学运算的研究都专注于找出让光子元件与CMOS相容的技术,以整合电子与光子装置。

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  • MM5483 is a monolithic integrated circuit utilizing CMOS metal-gate low-threshold enhancement mode devices.

    MM5483是一款单片集成电路,采用CMOS金属栅极的低阈值增强模式器件。

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  • MEMS devices with minimum volume and cost were realized by the embedded CMOS process.

    通过这种嵌入式CMOS工艺技术,可以实现具备最小体积、最低成本的MEMS器件。

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  • The vertical bipolar transistors (118) are taller devices than the CMOS transistors (116).

    垂直双极型晶体管(118)比CMOS晶体管(116)高。

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  • The vertical bipolar transistors (118) are taller devices than the CMOS transistors (116).

    垂直双极型晶体管(118)比CMOS晶体管(116)高。

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