The products of CF4 decomposition are analysed.
对CF 4分解的产物进行了分析。
Send a message using the Universal Test Client to destination jms/loggingQueue using connection factoryjms/CF4.
使用UniversalTestClient将消息发送到使用连接factoryjms/CF4 的目的地jms/loggingQueue。
The optical emission spectrum of r. f. plasma during amorphous silicon based film etching in CF4 gas is detected.
用该系统检测了仅用CF4作为刻蚀气体刻蚀非晶硅基薄膜的等离子体光发射谱。
The highest DRE of CF4 is up to 99%. The DRE is increased with the increase of microwave power, and is decreased with the increase of gas flow rate.
CF 4气体的最高分解率可达99%以上，分解率随微波功率的提高而增加，随气体流速的增加而减小。
The DRE of CF4 is enhanced about 10%by catalysts used, the ultraviolet radiation, high temperature and plasma all can actived the catalysts to decompose CF4.
添加催化剂与微波等离子体协同分解CF4时，去除率可以提高10%左右，紫外线，高温和等离子体自身都可以激发催化剂催化分解CF4。
The experiments show that CF4 treatment to silicon wafers can not only activate them but also polish their surfaces effectively, and it can improve the pre-bonding greatly.
实验表明，CF4对硅片的处理不仅可以激活表面，而且可以对硅片 表面进行有效的抛光，大大加强了预键合的效果。
NF3 has a relatively short atmospheric lifetime (740 years) and dissociates more readily than C2F6 and CF4. HF ultimately diffuses down to the troposphere where it is removed by wet deposition.
NF3具有相对短的大气寿命（740年），比C2F6和CF4。更容易分解。HF最终扩散到大气中，在大气中它通过湿沉积被除去。
NF3 has a relatively short atmospheric lifetime (740 years) and dissociates more readily than C2F6 and CF4. HF ultimately diffuses down to the troposphere where it is removed by wet deposition.
NF3具有相对短的大气寿命（740年），比C2F6和CF4。更容易分解。HF最终扩散到大气中，在大气中它通过湿沉积被除去。
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