• The conductive layer joins to a carrier substrate with an adhesive.

    导电层通过粘合剂接合至载体衬底。

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  • A plurality of isolated conductive layers is disposed on the carrier substrate.

    多个彼此隔绝的导电层,设置于承载基底上。

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  • A carrier substrate is thereafter attached to the laser-ablative adhesive layer.

    载体衬底随后连附到激光烧蚀粘合层。

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  • At least one chip is disposed on the carrier substrate, wherein the chip has a plurality of electrodes. The electrodes are electrically connected to the conductive layers.

    至少一芯片,设置于承载基底的凹槽中,其中上述芯片具有多个电极,上述电极电连接至该些导电层。

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  • A method of forming an exterior surface protective structure (12) for an aircraft (10) includes uniting a loaded surfacer (52) having a carrier (51) to a hybrid prepreg substrate (32).

    一种为飞行器(10)形成外部表面防护结构(12)的方法,包括将具有载体(51)的受载表面料(52)结合到混合预浸渍基材(32)。

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  • The loaded surfacer (52) with the carrier (51) is interfacially adhered to the prepreg substrate.

    所述带有载体(51)的受载表面料(52)交界 粘结到所述预浸渍基材。

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  • Substrate induced stress, process induced stress and use of different substrate orientations are major techniques that can significantly enhance carrier mobility.

    衬底诱生应力、工艺诱生应力和采用不同的衬底晶向等三类方法都可以显著提高载流子的迁移率。

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  • It can be used in medical carrier, biological substrate and other medical treatment.

    可以用在医药载体、生物基质等医疗方面。

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  • The effects of competitive product inhibition are shown to increase the substrate concentration in the carrier, and, additionally, to increase the effectiveness factors slightly.

    产物竞争性抑制的存在将增加载体颗粒内的底物浓度,对效率因子的影响较小。

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  • The package includes a chip carrier which has a metal substrate.

    所述封装包括有金属基片的芯片支座。

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  • Hot-carrier enhanced TDDB effect of ultra-thin gate oxide is investigated by using substrate hot-carrier injection technique.

    本文通过衬底热载流子注入技术,研究了热载流子增强的超薄栅氧化层TDDB效应。

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  • An apparatus is provided for thermally processing substrates held in a carrier. The apparatus includes a cross-flow liner to improve gas flow uniformity across the surface of each substrate.

    一种用于对容纳在一携载器中的基片进行热处理的装置,该装置包括一交叉流衬套,以便改善流过每个基片表面的气流的均匀性。

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  • The invention provides methods, systems and apparatus for opening a substrate carrier.

    本发明提供了用于打开衬底载具的方法、系统及设备。

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  • The substrate carrier is particularly suitable for substrate transferring in vacuum environment, and the transferring process is safe and has accurate location.

    本发明基片运载装置尤其适用于真空环境的基片传送,传送过程安全、定位精确。

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  • The substrate carrier is particularly suitable for substrate transferring in vacuum environment, and the transferring process is safe and has accurate location.

    本发明基片运载装置尤其适用于真空环境的基片传送,传送过程安全、定位精确。

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