Using bulk micromachining and silicon bonding we can achieve high-performance full-silicon sandwich accelerometer.
采用体微机械加工技术和硅硅键合技术可以实现高性能的加速度传感器。
A novel electrostatic actuated deformable mirror with continuous facet is designed and fabricated by using silicon bulk micromachining technology.
基于体硅微加工技术设计并制作了一种新型的采用静电驱动的连续面型可变形反射镜。
Compared with bulk micromachining, the surface micromachining has the advantages of low manufacturing cost and easy integration with CMOS circuits.
在加工工艺方面，与体微机械加工相比表面微机械加工具有工艺简单，容易与CMOS电路集成等优点。
This paper presented one single chip micro inertial measurement unit based on ordinary bulk micromachining process such as dissolved wafer process.
论文基于普通的体硅工艺设计实现了一个单片集成式硅微惯性测量组合。
Instead of surface sacrificial layer and bulk micromachining technique, using polymer as thermal isolation material decreases cost and improves yield.
以聚合物材料作为绝热材料，避免了表面牺牲层工艺和体加工技术，降低了成本、提高了成品率。
This paper investigates one kind of micro heat pipe arrays (MHPA), which are fabricated by advanced silicon bulk micromachining and anodic bonding technology.
介绍了一种基于硅体加工技术以及阳极键合技术的微热管阵列。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
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