An element bonding parameter topological index HLA is proposed based on topological principle and valence shell electron structural character.
基于元素键参数拓扑指数原理以及镧系元素价层电子结构特征构建了一种新的拓扑指数HLA。
It is deduced from the bonding parameter topological index he that a quantitative relationship must be existed between he and the thermal decomposition temperature of some sulfates.
从键参数拓扑指数一般形式出发，导出计算硫酸盐键参数拓扑指数公式，用于关联硫酸盐热分解温度的计算，结果满。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
The bonding strength is ensured by the correct choice of substrate material, surface preparation, adhesive and process parameter.
粘合强度可以通过选择正确的基体材料、表面处理、胶粘剂和工艺参数得以保证。
It is shown that using the same laser parameter has effect on bonding quality of surfacing and matrix with different layers by optical microcope, microhardness.
对覆层与基体结合机理进行了分析，发现随着堆焊层数的增加，激光堆焊对基材与覆层过渡区有加大的影响。
It is shown that using the same laser parameter has effect on bonding quality of surfacing and matrix with different layers by optical microcope, microhardness.
对覆层与基体结合机理进行了分析，发现随着堆焊层数的增加，激光堆焊对基材与覆层过渡区有加大的影响。
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