An element bonding parameter topological index HLA is proposed based on topological principle and valence shell electron structural character.
基于元素键参数拓扑指数原理以及镧系元素价层电子结构特征构建了一种新的拓扑指数HLA。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
The bonding strength is ensured by the correct choice of substrate material, surface preparation, adhesive and process parameter.
粘合强度可以通过选择正确的基体材料、表面处理、胶粘剂和工艺参数得以保证。
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