高密度互连。
供应商是否有能力提供高密度互连和微盲孔板的制造能力？
Does supplier have the ability to develop HDI or Microvia process?
随着IC的高速化、高集成化、高密度化和高性能化，芯片内互连线之间的串扰已经成为影响芯片性能的重要因素之一。
With the IC's higher speed, higher integration, higher density and higher performance, crosstalk has become one of the most important factors which can influence the IC's performance.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
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