为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
该芯片天线被制造为金属化的陶瓷基板的，类似的基于芯片的SAW滤波器，双工器，或定向耦合器。
The chip antenna is fabricated with metallization of a ceramic substrate, similar to chip-based SAW filters, diplexers, or directional couplers.
利用融盐热歧化反应进行了氮化铝陶瓷表面钛金属化沉积的动力学研究。
The kinetics of titanium deposition on AlN ceramic surface by heat disproportional reaction was studied.
重点介绍了片式多层陶瓷电容器(MLCC)的技术现状，综述了多层陶瓷电容器(MLCC)的小型化、高容量、贱金属化及环保化的发展趋势。
The development tendency of MLCC regarding its miniature, high capacitance, base metal electrode, environmental protection were introduced, and especially the technology status of MLCC.
本文报导了这种后处理的实施过程、控制条件及其结果，并讨论了后处理对于PZT陶瓷表面金属化及对PZT陶瓷元器件的电学性能的影响。
The experimental procedures of the post-treatment were investigated, and its effects on the metallization of PZT ceramic surface and the properties of the PZT ceramic components were discussed too.
本文报导了这种后处理的实施过程、控制条件及其结果，并讨论了后处理对于PZT陶瓷表面金属化及对PZT陶瓷元器件的电学性能的影响。
The experimental procedures of the post-treatment were investigated, and its effects on the metallization of PZT ceramic surface and the properties of the PZT ceramic components were discussed too.
应用推荐