陶瓷金属化是在陶瓷表面牢固地粘附一层金属薄膜，使之实现陶瓷和金属间的焊接，现有钼锰法、镀金法、镀铜法、镀锡法、镀镍法、LAP法（激光后金属镀）等多种陶瓷金属化工艺。
为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
该芯片天线被制造为金属化的陶瓷基板的，类似的基于芯片的SAW滤波器，双工器，或定向耦合器。
The chip antenna is fabricated with metallization of a ceramic substrate, similar to chip-based SAW filters, diplexers, or directional couplers.
利用融盐热歧化反应进行了氮化铝陶瓷表面钛金属化沉积的动力学研究。
The kinetics of titanium deposition on AlN ceramic surface by heat disproportional reaction was studied.
应用推荐