锡焊能够满意地做成加筋构件之间的接头。
Joints between reinforcement members can be made satisfactorily with tin solder.
触点电镀：镀镍金的接触面积的锡焊尾电镀。
Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.
的锡焊尾，电镀。
完美取代了传统的氩弧焊、锡焊、仿激光焊等工艺。
Perfect to replace the traditional argon arc welding, soldering, imitation of laser welding technology.
该系列产品采用自动送锡&自动破锡焊具，有效防止了了锡爆。
The products use the soldering set with automatically feeding solder paste and automatically breaking the solder paste to effectively prevent the solder explosion.
详细介绍了汽车仪表印刷电路板手工锡焊的组成要素及工艺过程。
This paper introduces in detail the component and technology process of printed circuit board hand tin-lead bonding of auto instrument.
更好。原来生产的有环氧层的电枢没有重新锡焊和再装轴的不必再浸漆。
此单元组还包括操作预先组合好的生产焊接，钎焊和锡焊设备的机器操作员。
This unit group also includes machine operators who operate previously set up production welding, brazing and soldering equipment.
重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
锡焊件、铅锡合金、锌压铸件、铍青铜、磷铜等合金在电镀前也常用预镀铜来改善结合力。
Tin welding parts and lead-tin alloy die casting, zinc, beryllium bronze, phosphorus copper alloy in electroplating copper with commonly used before also gets to improve adhesion.
详细介绍了汽车用低压电线束制作过程中导线手工锡焊的组成要素、工艺过程、质量检查。
The composition elements, technical process and quality inspection of handicraft tin welding in the process of low-voltage electric harness for automobile are introduced in this paper.
该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。
The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.
本发明公开了一种无铅无卤素锡焊膏，包括以下重量份组分：合金粉 80-98，助焊剂2-20；
The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;
随着电子产品制造寻求使电子互连无铅很多人都在找纯锡焊和涂层作为一个经济的替代传统的锡铅合金。
As electronics manufacture seek to make electronic interconnectio lead-free, many are looking at pure tin soldering and coating as an economical alternative to traditional tin-lead alloys.
不带软铜编织线的磁保持继电器，负载引出脚不能锡焊，不能随意扳动，且不能同时刚性固定两个引出脚。
Not with braided line relay, the load pin can not solder, not arbitrarily wrenched, two pins and rigid fixation.
具有降低制造成本，避免环境污染以及镀锌板不易锡焊等优点。适用于所有汽车燃油箱加油管与油箱的连接。
It has the advantages of low manufacture cost, no environmental pollution, etc. and is suitable for all kinds of automobiles.
丝网印刷在双面印年刷电路板（ PCB）工艺中起着重要作用，最关键的环节是要掌握好网印到PCB焊盘上锡焊膏的量，要做到这一点，需要综合控制好多种工艺因素。
The key factor is the proper amount of tin solder to be screen printed onto welded surface of PCB. To do this well, it's necessary to control several technological factors.
将电路板放置在焊台上，针对需要焊接的通孔元件管腿，选择合适的喷锡口，启动波峰焊接。
The circuit board is placed in the welding stage, the pins through hole components welding, choose appropriate spray tin, soldering start.
适用于波峰焊、热浸焊和高档引线搪锡。
Apply to wave soldering, welding and hot dip high-grade iron tin wire.
适用于高档电路板的波峰焊、热浸焊和高档引线搪锡。
Apply to the high-grade circuit boards wave soldering, welding and hot dip high-grade iron tin wire.
适用于电路板喷锡，热风整平，波峰焊、热浸焊和引线搪锡。
Tin spray applied to circuit boards, hot air leveling and wave soldering, welding and hot dip tin lead anyone.
吸锡枪及焊铁设计轻巧，适合长时间使用。
The design of absorb tin gun and soldering iron is lightweight, suitable for prolonged use.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
我们生产各种防音箱。机箱。机柜。生产流水线、波烽焊。锡炉制作。花架、公交站台。、不锈钢装饰工程。
We produce a variety of anti-speakers. Chassis. Cabinets. Production line, wave soldering fung. Tin furnace production. Flower, bus station., Stainless steel decorative works.
封闭后的雾面锡镀层仍有良好的可焊性。
The non-bright tin deposit has good solderability after sealing.
结果表明，该添加剂工艺稳定性好，且镀层可焊性优良、抗变色能力强，可取代高污染的锡铅电镀工艺。
The result proves that the process has advantages of high stabilization, excellent solderability and antitarnishing, which may replace high-pollution tin-lead electroplating technology.
研究了一种新型可焊性光亮锡锑合金电镀工艺的镀液配方和电镀操作条件；
A new electroplating technology of solderable bright Sn-Sb alloy of bath components and operating conditions were studied.
重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。
The forward compatibility backward compatibility tin whisker voids micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.
重点论述了前向兼容与后向兼容、锡须、空洞与微空洞、可焊性涂层以及如何避免无铅转移中出现的问题。
The forward compatibility backward compatibility tin whisker voids micro-voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed.
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