并展望了电子封装材料的发展前景。
The prospects for the further development of electronic packaging materials were given.
本文综述了电子封装技术的最新进展。
In this paper, new progress of electronic packaging technology is presented.
微电子连接技术是微电子封装技术中的重要环节。
Microelectronics connecting technology plays an important role in the microelectronics packaging.
举出了功能镀层及精密镀层在电子封装中的应用实例。
The application examples of functional coatings and precise coatings in electronic packages were listed.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
So study lead-free solder paste in the electronic application package is important.
本文对微电子封装化学镀镍生产工艺及应用进行了研究。
The techniques and application of electroless Nickel Plating on Microelectronic packaging was researched.
电子封装硬化使抵抗，特别是重型机械振动和意外的影响。
Hardened encapsulated electronics make it especially resistant to heavy machine vibration and accidental impacts.
电子封装，硬下提供重型机械振动和意外的影响，出色的可靠性。
The hardened encapsulated electronics offer outstanding reliability under heavy machine vibration and accidental impacts.
本文综述了电子封装技术的现状以及我国如何面对无铅化的问题。
The present paper is to cover the actuality of electronic packaging technology in the world and face the lead-free problem in homeland.
这样的材料在电子封装材料和印刷线路板中具有很大的应用前景。
The material is hopefully used as novel printed circuit board and package material of electronic components.
适应电子封装选材的应用背景，对复合材料进行了热学性能分析。
To meet the needs of the electronic package materials, the thermal properties of the composites were analyzed.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
介绍了电子封装材料绿色阻燃耐开裂环氧树脂灌封料的生产新方法。
A new production method of green electrical packaging material, which can resist fire and crack epoxy resin sealing compounds was introduced.
系列E14采用了最新的微电子封装，LED光源，及配套传感器。
Series E14 incorporates the latest in microelectronic packaging, LED light sources, and matched sensors.
该SL85硬化电子封装使其抵抗，特别是重型机械振动和意外的影响。
The hardened encapsulated electronics of the SL85 make it especially resistant to heavy machine vibration and accidental impacts.
事实上，IE盒Opera7已经电子封装嵌套的浮动，与标准不相同。
In fact, both Explorer and Opera 7 already do "auto-enclose" nested floats, in violation of the specs.
电子封装中的的焊点可靠性问题一直是电子封装中学科的前沿和热点问题。
In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
表面贴装电子封装提供抗水，油，灰尘，高温，冲击，振动和整体恶劣环境。
Encapsulated surface mount electronics provide resistance to water, oil, dirt, high temperatures, shock and vibrations and overall harsh environments.
本发明涉及聚苯基甲基乙氧基硅烷改性环氧树脂及其电子封装材料的制法。
The invention relates to polyphenyl methylsiloxane modified epoxy resin and a manufacturing method of an electronic packaging material thereof.
板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
曾任职上海新代车辆技术有限公司电子封装和质量中心部项目经理和技术经理；
She has been the project manager and technical manager of the packaging and quality center division of DaimlerChrysler SIM Technology.
目前，该方法在天线、微波器件、散射、电子封装等方面有着卓有成效的应用。
Now the method can be applied to antenna design, microwave circuit simulation electromagnetic scattering, and so on.
本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。
The recent research and development of the high performance epoxy molding compounds are summarized in the present paper.
获得的电子封装零件铸件的截面共分为三个区域：颗粒增强区、基体区和集渣区。
There were three regions in the sections of casting: the particles-rich region, the alloy-rich region and the inclusions-rich region.
为了满足上诉移动通讯产品的苛刻要求，大量的新兴电子封装技术和封装产品应运而生。
Many new packaging technologies and package types are developed to meet these stringent requirements of mobile communication.
广州市奥尚化工有限公司是专业提供粘接、密封、电子封装解决方案的化学物品服务商。
Guangzhou Austrom chemical Ltd. is chemical service company, which specialize on solution of bonding, sealing and over-molding of electronics.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
低温共烧陶瓷(L TCC)技术目前正逐渐走向成熟，并成为电子封装领域研究的热点。
With technology of low temperature co-fired ceramic going mature gradually, it evolves to investigative hot spot in the field of electronic packaging.
应用推荐