揭示了常规热丝法薄膜淀积工艺中热钨丝易断裂的原因。
The reason why tungsten wire is easy to break in the silicon thin film deposition process by hot wire deposition method was explained.
本文通过实验表明采用电化学淀积法，选择合适的电解质溶液和制备工艺条件，可以在液相中获得类金刚石薄膜。
It is indicated that DLC films can be deposited in liquid phase by choosing appropriate electrolyte and preparing technology by electrodeposition method.
金属化是淀积一层薄薄的金属膜的工艺，将其制成模版用于形成所需的内部互连排列。
Metallization is the process of depositing a thin film of metal and patterning it to form the desired interconnection arrangement.
针对微加工工艺过程造成的残余应力，文中提出了喇曼在线测量方法，并对最常用的三种微加工工艺：淀积、腐蚀或刻蚀及键合进行了喇曼在线测量。
This paper puts forward an online measuring method for measuring the stress in silicon samples prepared with three common micromachining processes: deposition, etching, and bonding.
在制作工艺方面具有更高的工艺重复性和栅介质淀积的均匀性。
It also has the advantage of preferable technique repetition and gate insulator deposition uniformity.
在制作工艺方面具有更高的工艺重复性和栅介质淀积的均匀性。
It also has the advantage of preferable technique repetition and gate insulator deposition uniformity.
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