... deposition film disk 沉积薄膜磁盘 deposition process 淀积工艺 depth bound 深度限度 ...
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化学气相淀积工艺 chemical vapor deposition method ; chemical vapor deposition,chemical vapor deposition method
And process conditions were obtained through experiment. Results indicated that reliability of the double-layer metallization was improved by optimizing deposition process to eliminate photoresist and/or corrosive residuals on the chip.
通过实验对比分析,确定芯片的隔离介质淀积工艺条件,从而避免光刻胶、腐蚀液等物质残留在芯片内部,提高双层金属布线的可靠性。
参考来源 - 双层金属布线中隔离介质淀积工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
揭示了常规热丝法薄膜淀积工艺中热钨丝易断裂的原因。
The reason why tungsten wire is easy to break in the silicon thin film deposition process by hot wire deposition method was explained.
本文通过实验表明采用电化学淀积法，选择合适的电解质溶液和制备工艺条件，可以在液相中获得类金刚石薄膜。
It is indicated that DLC films can be deposited in liquid phase by choosing appropriate electrolyte and preparing technology by electrodeposition method.
金属化是淀积一层薄薄的金属膜的工艺，将其制成模版用于形成所需的内部互连排列。
Metallization is the process of depositing a thin film of metal and patterning it to form the desired interconnection arrangement.
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