研究微机电系统(MEMS)中微梁结构在非线性电场力下的振动问题。
Vibration of a micro beam structure under the nonlinear electric field force in MEMS is studied.
此红外探测仪的核心器件焦平面阵列（FPA）由无硅基底结构的微悬臂梁阵列构成。
The IR detector contains a focus plane array (FPA) which is fabricated into an array of bi-material microcantilevers in the form of single-layer membranous structure without Si-base.
设计了一种硅微悬臂梁结构，在低频环境中以压电厚膜进行信号转换、谐振。
A silicon micro cantilever structure with piezoeLectric thick film was designed for low frequency operations.
微悬臂梁是一种结构简单、易于进行微加工以及大量生产的传感器结构。
Microcatilever is a kind of simple sensor configuration that is easily micromachined and mass produced.
本文研制的体硅工艺微振动传感器，其敏感单元为叉指电极结构，弹性梁采用新颖的多级折梁结构。
The sensing element of the bulk machining vibration sensors is consisted of comb electrodes, and its elastic beams are novel multi-folding beams.
针对成型电极在微细加工中暴露出的缺点，提出了利用旋转微细电极像微铣刀一样进行微细电解铣削新工艺，加工出高精度型孔和悬臂梁等微结构。
The new process of electrochemical milling by rotating microelectrode like micro milling-(cutter) was proposed, and micro profiled hole and micro beam with high precision can be milled.
研究了在微梁谐振器结构中，梁作高阶振动时挤压气体薄膜的阻尼效应。
The squeeze film damping effects on beam shaped micro resonator was studied.
为此，以矩形压电微悬臂梁结构作为换能单元，通过对压电层等效电流源和单相桥式整流电路的理论及相关公式的推导，得出微能量功率的计算公式。
An energy harvesting structure based on rectangle piezoelectric microcantilever was set up and the process of energy transform from vibration to electric was generally analyzed.
利用梯度功能压电执行器设计和制作了双悬臂梁结构的微夹钳，用作微型机器人操作系统的操作手。
A pair of functionally gradient piezoelectric cantilevers was used to fabricate a microgripper, which is used as the micromanipulator of micro robot operating system.
采用微细加工技术制作出无基底的双材料微悬臂梁阵列结构。
The micro-electromechanical system (MEMS) technology is adopted to fabricate the substrate-free bi-material micro-cantilever arrays.
多晶硅微悬臂梁是MEMS中的一个基本结构，作为机电结合的元件，在MEMS中具有不可替代的位置。
Poly—silicon micro—cantilevers is a basic structure, as a combination of mechanical and electrical components, place an irreplaceable part in MEMS.
多晶硅微悬臂梁是MEMS中的一个基本结构，作为机电结合的元件，在MEMS中具有不可替代的位置。
Poly—silicon micro—cantilevers is a basic structure, as a combination of mechanical and electrical components, place an irreplaceable part in MEMS.
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