• 在埋氧化层厚度不同SIMOX衬底制备了H栅结构器件

    H-gate devices were fabricated on SIMOX substrates with different thickness of BOX.

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  • 采用一种新的液相外延工艺,研制出了具有胶结构的V衬底条形可见光发射半导体激光器

    Using a new kind of liquid-phase epitaxy technology, V-channeled substrate inner stripe visible GaAlAs semiconductor laser with a large optical cavity is fabricated.

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  • 衬底ISFET一种化学敏感器件

    The substrate type ISFET is a chemically sensitive device.

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  • 半导体晶圆背面加工方法衬底背面加工方法,辐射固化压敏粘着片。

    Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.

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  • 利用CMOS工艺衬底双极晶体管温度特性设计了一种精度较高温度传感器

    A high accuracy temperature sensor is designed by applying the temperature characteristics of a substrate bipolar transistor in CMOS technology.

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  • 包括N颗粒01),衬底02),中间绝缘层05),表面透明导电06反射层07)构成。

    The solar cell includes N-type crystalline silicon particles (01), aluminum substrate (02), middle insulating layer (05), surface transparent conductive layer (06) and antireflection layer (07).

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  • 为了实现射频传输线衬底结构根据共面波导设计思想,设计体式共面波导射频微机械开关。

    In order to realize thin dielectric structure of the transmission line and combined the principle of the design of CPW, a cavity structure has also been studied.

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  • 这种产品得以开发由于采用外部衬底,该衬底改进增强陶瓷材料制造的。

    This development has been made possible by the adoption of a thin exterior substrate made of an improved ceramic material that provides enhanced strength.

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  • 本文提出了一种衬底加工安培微电极生物传感器

    A new silicon-based bulk micro-machined amperometric microelectrode biosensor is designed and fabricated with anisotropic silicon wet etching.

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  • 结构中,钝化(112)位于衬底(110)之上,在垂直双极晶体管(118)CMOS晶体管(116)之间

    In this structure, a passivating layer (112) is positioned above the substrate (110), and between the vertical bipolar transistors (118) and the CMOS transistors (116).

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  • 一种可替代电路中每个负载器件(M3,M4)的衬底相连并且偏置区工作

    In an alternative circuit, each load device (M3, M4) has its bulk connected to its drain and is biased to operate in the weak inversion regime.

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  • 一种可替代电路中每个负载器件(M3,M4)的衬底相连并且偏置区工作

    In an alternative circuit, each load device (M3, M4) has its bulk connected to its drain and is biased to operate in the weak inversion regime.

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