贴片灯珠，全自动化回流焊生产；
SMD lamp beads, manufactured through full automatic reflow soldering line.
适用于回流焊，流动和铁焊接过程。
清楚怎样测量回流焊和波峰焊温度曲线。
通过回流焊操作为焊接pcb提供最佳温度。
Provides an optimum temperature for soldering PCB throughout reflowing operation.
无铅波峰焊，波峰焊，波峰焊接机，回流焊。
Lead-free wave soldering, wave soldering, wave soldering machines, reflow.
在回流焊形成的合金层中也有一些微孔和裂缝。
There are also some micropores and microcracks in the reflowed alloy.
最明显的是，使用无铅锡膏必须提高回流焊温度。
The most obvious is the necessity for increased reflow temperature.
回流焊的运动部分包括链轮、网带、宽窄调节、启盖等。
The moving parts of reflow welder include the chain wheel, mesh belt, wideness adjuster and cover.
介绍了通孔回流焊的概念、特点、分类和使用工艺要点。
The things of through-hole reflow's concept, characteristics, division and technical gist are described in this paper.
在开启回流焊之前，连接好排气系统，并确认正常运行。
The exhaust system shall be connected and checked before starting the welder.
新型天线结构和材料使回流焊、多层的成分载体和因此多功能系统。
New antenna structures and materials enable reflow soldering, multilayer component substrates and thus multifunctional systems as well.
适用于回流焊时对金手指的保护，电子线路板过锡炉和波峰焊锡遮蔽。
Suitable for reflow when cheat protection, electronic circuit boards wave soldering tin stove and shelter.
速度测量模块与速度控制模块通过控制变频器来调节回流焊的传输速度；
Speed measuring and controlling module realizes the control of Refolw Soldering transfer speed by manipulating transducer .
其中无铅波峰焊、无铅回流焊经过几年研究开发，目前已达到国际先进水平。
Which lead-free wave soldering , lead-free reflow after several years of research and development, has now reached international advanced level.
清洗对象包含：合成石治具、不锈钢治具，托盘，回流焊炉冷凝器，过滤网；
It can clean composite stone Fixture, SUS jig, Tray, Reflow oven cooler and Filter;
本文设计的回流焊温度测试仪由现场单片机控制的测试系统和上位微机组成。
In this paper, we design an instrument that consists of a detection system controlled by single chip microprocessor and a computer.
当中包括光普分析仪、盐雾测试机、红外线回流焊、恒温炉、电流负载等设备。
Including optical analyzer, salt spray test machine, infrared reflow soldering, constant temperature oven, current load, etc.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
另外，POSCAP即使在规范、规定的条件内进行回流焊，焊接后的漏电流也有可能变大。
In addition, POSCAP even in the specification, within the conditions prescribed reflow, the leakage current after welding may also be larger.
在设计插件回流焊印刷模板时，应尽可能设计成普通模板以简化工艺流程和满足较好的印刷效果。
Design the stencil as common as possible when designing insert reflow soldering stencil, in order to brief technological process and meet better print effect.
该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。
This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.
公司拥有无铅回流焊、高速贴片机及无铅环保车间，高度重视产品品质，为客户生产出稳定、合格的产品。
We pay more attention on the products quality and produce the stable, and qualified products for our customers.
公司拥有各种先进的生产设备和检测设备，如进口波峰焊、全热风回流焊、超声波及全自动开关电源测试仪。
We owns various advanced production facility and inspection equipment, such as wave crest solder, hot wind flow solder, ultrasonic and full-automatic switch power supply test instrument.
本文全面的分析了回流焊温度曲线在回流焊工艺中的作用，回流焊工艺的工艺特点、影响回流焊温度曲线的各种因素。
In this paper, we analyze the function of the thermal reflow profile in reflow process, characteristics of reflow process, factors of thermal reflow profile.
公司拥有九洲松下CM 88c - M高速贴片机、多温区回流焊等设备以及空调房生产车间，是产能和品质保证。
JLG will provide production capacity and quality assurance for our customer by Panasonic CM88C-M Hi-speed mounting and reflow equipment in air conditioned workshop.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
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