• 分析了金硅基本原理讨论了键合实验的基本工艺给出了键合测试结果

    The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.

    youdao

  • 分析了金硅基本原理讨论了键合实验的基本工艺给出了键合测试结果

    The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.

    youdao

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