The multi-year collaboration delivered the foundational modeling technologies for 3D parasitic extraction, circuit simulation and physical design-rule support of FinFET devices.
We continue to pool our expertise to deliver innovative FinFET solutions.
The shift from planar to FinFET-based 3D transistors is a significant change that requires close technical collaboration between tool developers, foundries and early adopters to deliver a strong solution.
"Samsung is a key partner in our effort and investment to develop a complete solution for FinFET technology, " said Antun Domic, senior vice president and general manager of Synopsys' Implementation Group.
"FinFET transistors can deliver lower power consumption and higher device performance, but they also bring tough challenges, " said Dr. Kyu-Myung Choi, vice president of System LSI infrastructure design center, Device Solutions, Samsung Electronics.
While the FinFET process offers significant power and performance benefits compared to the traditional planar process, the move from two-dimensional transistors to three-dimensional transistors introduces several new IP and EDA tool challenges such as modeling.
The test chip will enable the correlation of the simulation models to the FinFET process and contains test structures, standard cells, a PLL and embedded SRAMs. The memory instances include high-density SRAMs designed to operate at very low voltages and high-speed SRAMs to validate the process performance.
Although Globalfoundries was not able to bring a FinFET transistor to market as fast as Intel, it has benefited from a decade of work on these 3D structures carried out by IBM and contributed to the Common Platform, which includes Globalfoundries and Samsung as well as IBM.
FORBES: Globalfoundries Pirouettes Around The Process Node Problem
Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that its multi-year collaboration with Samsung on FinFET technology has achieved a critical milestone: the successful tapeout of the first test chip on Samsung's 14LPE process.
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